AMB Si₃N₄ Copper-Clad Substrates

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AMB Si₃N₄ Substrate

Product Introduction

Silicon nitride substrates are high-performance ceramic substrates featuring high thermal conductivity, high strength, high hardness, high resistivity, excellent thermal shock resistance, low dielectric loss, and a low CTE. As wide-bandgap semiconductors progressively replace traditional silicon-based devices, and power electronics move toward higher voltage, higher current, smaller footprint, and greater power output, Si₃N₄ ceramic substrates have become the preferred material for high-frequency circuits and power module thermal management and packaging.

Key Features

  • Excellent electrical properties
  • Excellent thermal shock resistance
  • Superior bonding strength
  • Copper thickness is customizable upon request